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Aluminum Nitride(AlN)
This high-performance, advanced ceramic combines exceptionally high thermal conductivity with excellent electrical insulation, making it ideal for semiconductor LEDs, power electronic components, and telecommunications equipment where thermal management is critical.
With a low coefficient of thermal expansion, high mechanical strength, and excellent corrosion resistance, it maintains outstanding strength even at high temperatures. It also offers strong chemical resistance and performs reliably in plasma environments.
Thickness: Achievable down to 0.05 mm.
* May vary depending on material hardness and surface condition. (Please contact us for further details.)
Key commercial applications
Heat-Dissipating Substrate: Used in applications that require high heat dissipation, such as high-power LEDs, automotive power semiconductors (IGBTs), and base boards for 5G communication equipment.
Semiconductor manufacturing equipment: Used in key equipment such as electrostatic chucks (ESC) and heater plates, which hold wafers in place and distribute heat uniformly during semiconductor processes.